VisIC Technologies announced a partnership with Heraeus Electronics, an electronic assembly & packaging materials manufacturer, and PINK, a sintering equipment manufacturer, to develop an advanced power module using its D3GaN technology.
This power module is based on a silicon nitride (Si₃N₄) ceramic substrate, an innovative silver (Ag) sintering process, and advanced top-side interconnects.
D3GaN Technology:
VisIC’s D3GaN technology is central to this power module, and they’ve reported recent significant improvements in efficiency, thermal management, and power density due to this technology. Leveraging gallium nitride’s superior electrical properties allows faster-switching speeds and higher power handling capabilities compared to traditional silicon-based devices.
Silicon Nitride (Si₃N₄) Metal Ceramic Substrate:
A key innovation in this power module is its use of a Si₃N₄ metal ceramic substrate. Known for excellent thermal conductivity, mechanical strength, and reliability under high-temperature conditions—properties crucial for electric vehicle applications—the company states that it ensures optimal performance while withstanding everyday use rigors.
Silver (Ag) Sintering Process:
PINK’s adoption of the silver sintering process enhances both thermal and electrical conductivity within the module. Silver sintering—a low-temperature bonding process—creates robust connections between components improving overall durability and efficiency according to VisIC Technologies’ report. This process is critical for maintaining high reliability required in EV powertrains where consistent performance is essential.
High-Reliability Module for BEVs
The resulting power module reportedly meets stringent reliability standards necessary for modern BEVs by delivering over 500Arms/650V high-power density efficiently while offering long-term durability at costs comparable to silicon devices.
Source
